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Built to support electronics manufacturers needing PCB assembly, companies looking for a dependable manufacturing partner, and startups needing R&D and prototyping support.DESIGN • PROTOTYPE • SOURCE • ASSEMBLE • TEST • PRODUCE •

PCB Design & Development

We deliver comprehensive engineering support from initial schematic design to advanced PCB layout. Our team focuses on technical precision and Design-for-Manufacturing (DFM) considerations to ensure your product transitions seamlessly from concept to high-volume production.

Assembly Services

We provide comprehensive PCB assembly solutions and full product build support, from new product introduction through to stable mass production. Our lines are designed to support scalable, high-quality manufacturing for electronics OEMs, technology businesses and startups.

Product Assembly & NPI

New product introduction, sub-assembly, box build and integration from prototype to production.

Full product assembly for IoT devices, telecommunications equipment, computer peripherals and EV chargers — and we welcome product assembly and production partnerships across a wide range of electronics.

Dedicated support for pilot builds and project runs, from requirement review to stable production.

PCB Assembly Specifications

High-speed, fine-pitch SMT assembly with automated paste printing and inline inspection.

Up to 60,000 CPH placement, handling 0201 to 32×32 mm components on boards up to 600 × 460 mm.

8 + 8 zone reflow with independent top/bottom temperature control for stable solder profiles.

Combined SMT and through-hole processing for mixed-technology assemblies.

Integrated SPI plus dual 2D/3D AOI for full post-reflow defect coverage.

Manual and automated insertion, wave soldering and hand soldering for complex builds.

Moisture & ESD Control

MSL & Moisture Control: Controlled handling and bake-out for moisture-sensitive components.

ESD Control: Static-safe handling maintained across every workstation and process step.

Inspection & Quality Control

FAI — First Article Inspection: First-piece verification before full-rate production begins.

SPI — Solder Paste Inspection: Automated paste inspection inline before component placement.

AOI — Automated Optical Inspection: 2D & 3D defect detection across boards after reflow.

IQC — Incoming Quality Control: Verification of materials and components on arrival.

IPQC — In-Process Quality Control: In-line checks built into every stage of assembly.

Verification & Compliance

Traceability: Lot and batch tracking maintained from receipt through final release.

ICT / FCT — Electrical & Functional Testing: Circuit verification against test requirements.

NCR, CAPA & 8D: Structured root-cause analysis for every nonconformance.

Supply Chain Coordination

We manage the entire component sourcing lifecycle, from strategic supplier coordination to real-time availability tracking. Our technical team ensures your production timelines remain uninterrupted by leveraging a global network of verified suppliers and advanced logistics support.

Quality, Testing & Engagement

Quality Checkpoints in Practice

MSL & Moisture Control
Controlled handling and bake-out for moisture-sensitive components.

ESD Control
Static-safe handling maintained across every workstation and process step.

FAI — First Article Inspection
First-piece verification before full-rate production begins on every build.

IQC — Incoming Quality Control
Verification of materials and components on arrival, against specification.

IPQC — In-Process Quality Control
In-line checks built into every stage of the assembly process.

SPI — Solder Paste Inspection
Automated paste inspection inline with printing, before placement.

AOI — Automated Optical Inspection
2D & 3D defect detection across every board after reflow.

Traceability & Component Control
Lot and batch tracking maintained from receipt through final release.

ICT / FCT — Electrical & Functional Testing
Circuit and functional verification against customer-defined test requirements.

NCR, CAPA & 8D
Corrective action system — structured root-cause analysis for every nonconformance.

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